Unfilled PEEK Wafer Retention Ring for a Semiconductor Equipment OEM

Challenge

A large, thin circular part that warps easily when stress releases unevenly, with strict low-particle surface requirements for the wafer environment.

Our approach

A symmetrical, layered cutting strategy with low-force vacuum fixturing. Sharp tungsten-carbide tooling and dry machining. Verification on a CMM at a controlled 20 °C once the part had fully stabilised.

Result

Consistent roundness and flatness from batch to batch. Low particle generation, suitable for the wafer-handling environment.